A flexible module design with LEDs based on Film Assisted Molding technology
Generally using of LED-chips for displaying and lighting is becoming a trend today and also in future.The study focus on the process of assembling LED chips on the polyimide–CCL and molding the flexible layer to implement a flexible module.The flexible structures is designed that the LEDs are bonded with their bottom pad to the copper electrode by the conductive silver glue,the top contacts of the LEDs are wire bonded.The LED chips are packaged by epoxy resin and silica gel.The epoxy resin acts as a protective layer to promote conservation of the electrical interconnection with LED chips.The silicone can achieve a certain degree of stretching and bending without damaging the flexible structures.In order to study the flexible structures,the mechanical properties of elastic and viscous are tested by DMA (Dynamic Mechanical Analysis).The T3ster transient thermal analysis tester is employed to measure the electrical and thermal properties of the flexible structures.And at last,we discuss the failure model at different DC voltage in lighting 48 hours.
国内会议
宜昌
英文
1-4
2014-05-15（万方平台首次上网日期，不代表论文的发表时间）