Fabrication of LED full-color display matrix with small pixel
Thanks to the development in epitaxial growth,chip fabrication and packaging of LEDs,emission spectral of the device is capable of covering the visible spectrum.Therefore,Light-emitting diode (LED) is currently undergoing a growing interest in many applications,such as lighting.Besides lighting,LEDs offer a wide range of potential applications including display.In contrast with LCD,LEDs display has better contrast ratio,higher response rate etc which makes LEDs along with other self-illumination technologies an ideal candidate in making display panel.Due to the popularization of HD and Ultra HD standard,display panel with better image quality is needed which means the number of pixels of the panel needs to be increased while the size of each pixel needs to be minimized.In this paper,we demonstrated a LED full-color display panel based on a 32×32 LED matrix with typical pixel size of 0.5mm.Benefit from the application of flip-chip bonding,LED full-color display array with small pixel was obtained by mounting red LEDs,green LEDs and blue LEDs directly onto an isolating substrate.In addition,the substrate has metalized pads and connection before the matrix was connected to control unit.Comparable brightness of the LED matrix emitting at different color was achieved by adjusting the input current.The isolation layer consists of a SiO2 layer of 800nm and polyimide layer of 2700nm.Polyimide as an important electrical insulating layer,we study some properties of it,such as:PI amination rate as a function of the curing temperature,PI resistivity as a function of the curing temperature and the punction electric field intensity of PI as a function of the film thickness of PI.
small pixel display flip chip LED LED array LED display LED matrix
国内会议
宜昌
英文
1-6
2014-05-15（万方平台首次上网日期，不代表论文的发表时间）