Thermal Transient Testing of LEDs:A Technique Enabling the Design and Manufacturing of Reliable SSL Products

摘要：

　　The reliability,useful operating life time and luminous flux are basically determined by the junction temperature of an LED device,therefore the life time and reliability of the final SSL application (such street lighting luminaire,cars’ head lights,etc) as well.And this temperature is directly proportional to the total junction-to-ambient thermal resistance of the heat-flow path of the LED application.This paper provides an overview of the application possibilities of the thermal transient testing of LEDs (using the latest applicable JEDEC standards) in component level characterization as well as during product design,including options of die attach testing,in-situ TIM testing,during life time testing and luminaire level design and testing.

作者: András Poppe

作者单位: Mentor Graphics Mechanical Analysis Division MicReD Inforpark D,Gábor Dénes utca 2,Budapest,H-1117 Hungary

会议类型: 国内会议

会议名称: 第十届中国国际半导体照明论坛

会议地点: 北京

会议语种:英文

页码: 32-36

在线出版日期: 2013-11-10（万方平台首次上网日期，不代表论文的发表时间）