LED encapsulation and integration with Film assisted molding technology

摘要：

　　Single LED package based on encapsulated leadframe provides a common electrical and thermal path with dramatic reduction of its thermal resistance.The specific LED packaging technology consists of a silver plated copper leadframe overmolded with a reflective white compound.This paper presents low cost molding process to mold the leadframe with bleed/flash free.With single/double films lining of the molded parts,film assisted transfer molding technology(FAM) provides easy release of the compound from the mold and keeps specific surfaces clear from the molding compound.The LED module based on the leadframe encapsulation and LED system wafer level integration can be easily reached with low cost by FAM technology to keep certain LED surfaces and sensor clear.

作者: Lingen Wang Ton van Weelden Cadmus Yuan Jia Wei

作者单位: Boschman Technologies B.V.,Duiven,The Netherlands State Key Laboratory of Solid State Lighting,Beijing,China Delft University of Technology,Delft,Netherlands

会议类型: 国内会议

会议名称: 第十届中国国际半导体照明论坛

会议地点: 北京

会议语种:英文

页码: 98-103

在线出版日期: 2013-11-10（万方平台首次上网日期，不代表论文的发表时间）