This paper investigated thermal behavior of three kinds of FC packages connected with AuSn,SAC305,and electrical conductive adhesive using 1-D thermal resistance circuit method,and finite element method as well as experimental measurements.Simulation results indicated that the low thermal conductivity of electrical conductive adhesive led to high thermal resistance at this layer and decreased the thermal dissipation of the package as a bottleneck when the heat power was 0.74W in this study.The junction temperature and Rjc of adhesive package was much higher than the other two and led to package failure.SAC soldering package showed similar heat dissipation ability with the AuSn one.Additionally,the results of FE analysis show better agreement with experimental observation compared with 1-D thermal resistance circuit method.
Yang Liu Hongyu Tang Guoqi Zhang Fenglian Sun Xuejun Fan Cell K.Y. Wong Cadmus A. Yuan Tuo Zheng Chao Huang Chenglong Zheng
School of Material Science and Engineering,Harbin University of Science and Technology Harbin,China; State Key Laboratory of Solid State Lighting Changzhou Base Changzhou,China Beijing Research Centre,Delft University of Technology Beijing,China;State Key Laboratory of Solid S School of Material Science and Engineering,Harbin University of Science and Technology Harbin,China Lamar University Texas,USA Beijing Research Centre,Delft University of Technology Beijing,China;State Key Laboratory of Solid S Beijing Research Centre,Delft University of Technology Beijing,China;State Key Laboratory of Solid S