An improved electrophoretic deposition method for wafer level white pc-LED array packaging
Combining the blue light-emitting diodes (LEDs) with the yellow phosphors,as called phosphors-converted white light-emitting diodes (pc-WLEDs),is an approach widely used for fabricating white LEDs.The investigation on an advanced electrophoretic deposition (EPD) method of conformal phosphor coating for pc- WLEDs packaging is presented in this paper.With spray process,the antimony tin oxide (ATO) nanoparticles were applied to surface of LED array to achieve an evenly coated transparent conductive layer as electrode (i.e.cathode for EPD process).A particular surfacemodifier was added to increase the electric double layer region of the prepared phosphor particles suspension.The experiment results show that a compact uniform distribution of phosphor coating layer surrounding the LED chip surfaces was realized with this newly developed EPD method.The prototype of phosphor coating in mult-chip arrays scale demonstrated that a Wafer Level Chip Scale Packaging (WLCSP) for white pc-LEDs can be achieved with the improved EPD method in this work.
Xuemei Wang Haibo Rao Qiaolin Lei Da zhou Xianlong Wan Jianhua Li
University of Electronic Science and Technology of China,Chengdu,China 610054 Miraclleds Semiconductor Co.,Ltd,Yixing,Jiangsu,China 214200
国内会议
北京
英文
192-194
2013-11-10（万方平台首次上网日期，不代表论文的发表时间）