Analysis of the let-through current capability of PCB
During the process of the integration and miniaturization design of electronics, the thermal analysis of the printed circuit breaker (PCB) has become a very important issue.This paper introduces an integrated calculation method that couples the calculation of the current distribution and the steady temperature field using the finite element software ANSYS.The temperature field of a typical PCB is calculated based on the thermoelectric coupling method.In addition, relevant experiment is also carried out, which confirms the validity of present calculation method and results.
PCB thermal analysis contact resistance temperature field
Shutong HU Feng CHONG Xingwen LI Chengzhang HAN Yongfa ZHU
State Key Laboratory of Electrical Insulation and Power Equipment,Xi”an Jiaotong University,Xi”an,Sh Huawei Technologies Co.Ltd.Longgang District,Shenzhen,518129,China
国内会议
武汉
英文
27-30
2013-11-16（万方平台首次上网日期，不代表论文的发表时间）