Core/shell-structured of copper phthalocyanine supported on TiO2 particles:Solvothermal-fabrication and improve their interfacial compatibility in PEN matrix
(0) In this paper, core/shell-structured tetra-nitrophthalocyanine copper/titanium dioxide (TNCuPc-TiO2) hybrid particles were successfully synthesized through a facile solvothermal synthesis route.Its morphology, chemical composition and TNCuPc content were verified using scanning electron microscopy (SEM), transmission electron microscopy (TEM), energy dispersive spectrometer (EDS), Fourier transform infrared spectrum (FT-IR), thermogravimetric analysis (TGA) and derivative therrnogravimetric analysis (DTG).The results indicated that TNCuPc particles were successfully decorated and formed a thin and ragged shell on the surface of TiO2 particles.Polyarylene ether nitrile (PEN) composite films with TNCuPc-TiO2 hybrid particles were prepared through solution-casting method, which were characterized using thermogravimetric, mechanical and electrical analysis.Besides, SEM images of the composite films revealed that TNCuPc-TiO2 particles showed better dispersibility and interfacial compatibility in the PEN matrix.DSC curves presented that the glass transition temperatures were in the range of 191-204 ℃.Furthermore, compared with pure PEN film, TGA curves of the PEN/TNCuPc-TiO2 composite films revealed slightly decreased in 5% weight loss temperature (T5%) by 4-16 ℃ and maximum decomposition rate temperature (Tmax) by 11-30 ℃, respectively.In addition, the composite films also possess better mechanical property even the TNCuPc-TiO2 hybrid particles loading reached 40 wt%.More importantly, the permittivity of the composite film was as high as 19.8 at 100 Hz when the mass fraction of TNCuPc-TiO2 hybrid particles loading reached 40.0 wt%.Compared with the permittivity of PEN/TiO2 composite films with 40.0 wt% raw TiO2 particles loading, the dielectric constant has increased by 161%.
Polyarylene ether nitrile Titanium dioxide Core/shell structure Interfacial compatibility Thermal properties Dielectric properties
Zejun Pu Lifen Tong Ya Long Mengna Feng Wei Yang Xu Huang Xiaobo Liu
High Temperature Resistant Polymers and Composites Key Laboratory of Sichuan Province,Institute of Microelectronic & Solid State Electronic,University of Electronic Science & Technology of China,Chengdu 610054,P.R.China
国内会议
成都
英文
306-318
2013-11-15（万方平台首次上网日期，不代表论文的发表时间）