Study of A compound processing method of polycrystallinediamond (PCD) combined diffusion machining with grinding
This article introduces the compound machining method of polycrystalline diamond(pcd), according to themachining characteristics of different components in polycrystalline organization, this machining method combines diffusionmachining with grinding. Diffusion processing was used for diamond component in the polycrystalline; at the same time, thebinder which hinders the diamond diffusion processing was grinded. After the composite processing, PCD organization wasstudied, which uses SEM and other analysis methods. Research shows that: polycrystalline diamond component wasremoved by the diffuse processing; binder component was removed by grinding processing. The investigation shows that thediffusion -grinding process has many more advantages than traditional method in machining polycrystalline diamond (PCD).
PCD polycrystalline diamond diffusion processing lapping processing
Cui Zhong Ming Kong Jian Ping Han Ya Guang
College of Mechanical &Electrical Engineering, Henan University of Technology, Zhengzhou 450007,China
国内会议
无锡
英文
90-93
2012-10-19（万方平台首次上网日期，不代表论文的发表时间）