Fabrication of quartz fiber reinforced Polysilazane Composites with Low Dielectric Constant and Loss
In present study, quartz fiber reinforced vinyl-contained polysilazane (Vi-PSN) composite has been fabricated with a resin-like method. Elementary studies on the Vi-PSN matrix show that the polymer is crosslinking at 160 ℃ by adding dicumyl peroxide (DCP). Thermal treatment (280-420℃) after crosslink enhances the thermal stability due to the formation of three dimensional structures through transamination reaction. The composites as prepared at 220℃ and thermal treatment between 280 and 420℃ possess flexural strength of 180-55 Mpa and true density of 1.79-2.12g/cm-3. The flexural strength decreases with the increase of thermal-treatment temperature. Combining thermal properties and mechanical strength data, dielectric properties of composite as prepared and thermal-treated at 380℃ (S380) are compared. The results show the thermal and dielectric properties of S380 keeping with good mechanical properties are significantly improved: decomposition temperature up to 592℃ with dielectric constant of 3.1-3.2 and dielectric loss of 0.0010-0.0022.
polysilazane composite dielectric properties thermal properties mechanical properties
Zongbo Zhang Xiujun Wang Wei Liu Yongming Luo Caihong Xu
Institute of Chemistry,Chinese Academy of Sciences,Beijing 10090Graduate School of Chinese Academy o Institute of Chemistry,Chinese Academy of Sciences,Beijing 10090
国内会议
天津
英文
1-8
2011-10-26（万方平台首次上网日期，不代表论文的发表时间）