CMOS-MEMS and 3D Integration:Process Technology Enabling Low Cost, Further Miniaturized MEMS
(0) CMOS一MEMS and 3D integration are well recognized as the ultimate technology solutions forfurther miniaturized, low cost MEMS system IC manufacturing particularly to meet the ever stringenttechnical and economic requirements for smart phones, tablets and portable electronics as well asfuture wireless sensor network (WSN) applications. Under an expanded definition, the CMOS-MEMStechnology provides a series of silicon-based MEMS device fabrication technologies by leveraging quitebroad existing CMOS and/or CMOS compatible wafer processing toolset, capability and large scalemanufacturing infrastructure at low cost with high efficient and quality.
集成电路 微机电系统 硅器件 制造技术
Herb Huang
SMIC, Director of MEMS and 3D-IC Technology Development
国内会议
苏州
英文
1-2
2011-10-27（万方平台首次上网日期，不代表论文的发表时间）