Custom IC Design Solution for MEMS-IC
Complex SoC designs are facing increased challenges, including design Verification, design implementation and design integration. The presentation shall briefly review the trends in SoC design,introducing Cadence custom IC design solution for MEMS-IC design. Demanded by cost reduction,time-to-market, performance and reliability, electronic system integration is requiring to combine CMOS-IC with MEMS on a 3D system, and other sensors on a heterogeneous system, which adds up a comprehensive test technology, from MEMS testing, RF testing and design-for-test in IC chip. To design on higher performance chips and systems,from IC on Silicon一SoC-IP Realization to System with SW/<br> HW co-design, Cadence has Visualized future needs called ”EDA360”一”The Way Forward for Electronic Design”.
微机电系统器件 集成电路 协同设计
Chunzhang Chen
Application Engineer Technical Cadence Design Systems, Inc.(China)
国内会议
苏州
英文
1-13
2011-10-27（万方平台首次上网日期，不代表论文的发表时间）