Micro-Via Filling Plating Technology for PCB & IC Substrate Application
The trend of electronic products toward lighter, thinner, and faster transmission is challenging the printed circuit hoard industry to incorporate high density interconnection technology(such as build up and semi-additive process ) . Micro stacked via is one technology utilized to produce high density structures. Dielectric resin, conductive paste or via filling plating are usually applied for filling process. This article will discuss the influence of different equipment design, operation conditions and additives on via filling plating technology.
电子产品 微堆叠技术 密度互连 半添加剂
叶成镜 蓝国兴
伊希特化公司
国内会议
上海
英文
455-468
2004-03-08（万方平台首次上网日期，不代表论文的发表时间）