Online-TCT: New Measurement Technique for Precise Results at Accelerated Lifetime Tests for PCBs
There are two common techniques for testing the lifetime of printed circuit boards (PCBs) under environmental thermal stress: the well established thermal cycling test (TCT, e.g. IEC 68, JESD22-A104-B), also called thermal shock test (e.g. MIL-P-55110 E, IPC-TM-650 2.6.7) and the interconnect stress test (1ST, 1PC-TM-650 2.6.26). While for the TCT - when carried out classically with microsections after finishing the test - the failure analysis is neither statistically significant nor correlated to the function of the PCB, the fast IST detects the failures in a statistically more significant way by a functional criterion (resistance increase). However, the TCT is widely accepted - especially in the automotive industry -whereas for the IST temperature cycling happens in a physically different way. Thus up to now little is known about its correlation to the TCT and so its acceptance is still low. The TCT with real-time resistance measurement at daisy chains (Online-TCT) combines the advantages of both methods: the wide acceptance of the lest method and the statistically significant way of failure detection by a functional criterion.
印刷电路板 热循环试验 热冲击 硬质合金 电阻测量 故障检测
Stefan Gerhold Stefan Neurnann Detlev Nitsche Nasser Kanani Axel Ballon2
Atotech Deutschland GmbH，Berlin
国内会议
上海
英文
405-416
2004-03-08（万方平台首次上网日期，不代表论文的发表时间）