The Study, Measurement, and Prevention of Tarnish on Immersion Silver Board Finishes
With increased environmental legislation against lead in the electronics industry, circuit board manufacturers arc expecting chemical suppliers (o formulate lead free alternatives with the same functionality as tin/lead. These alternatives are needed for board finishes, in the solder, and on the components adhered to the circuit board. It is a benefit for the chemical supplier to educate the assembler and Original Equipment Manufacturer (OEM) on the differences experienced with there new alternatives. The appearance and characteristics of these new finishes vary somewhat from the incumbent lead-containing standards. Functionality remains the same if not better in some cases. The main focus of this study was the immersion silver surface finish. As interest moves away from HASL final finishes there has been a greater attraction to immersion silver in particular. This paper will explore the effects of operating and storage environment on immersion silver surface finishes and help to explain the functional capabilities the finish has after accelerated aging conditions.
电路板制 表面光洁度 浸银 环境立法
Lenora Toscano Donald Cullen
Mac Dermid,Inc.上海市漕溪路250号银海大楼A510室
国内会议
上海
英文
353-360
2004-03-08（万方平台首次上网日期，不代表论文的发表时间）