Investigation of the recommended immersion Tin thickness for lead free soldering
(0) To ensure reliable assembly of complex boards, it is necessary to apply enough AT to the reflow profile, much higher than the melting point of the used solder. This will enable a temperature distribution even on the complex boards, so that all components will be soldered.To ensure reliable assembly of complex boards, it is necessary to apply enough AT to the reflow profile, much higher than the melting point of the used solder. This will enable a temperature distribution even on the complex boards, so that all components will be soldered.
元件焊接 温度分布 焊料熔点 印刷电路
Sven Lamprecht
Product Manager-SF Atotech Deutschland GmbH
国内会议
上海
英文
286-299
2004-03-08（万方平台首次上网日期，不代表论文的发表时间）