Can peel strength predict the structural integrity of the adhesive bond between the copper and laminate in a PCB?
The structural integrity of a printed circuit is for the most part dependant upon the adhesive bond between the copper component and the resin glass laminate. A failure mode is normally a delamination between a copper component and the laminate. To enhance this bond, PCB fabricators treat the bond site of the copper, I.e. the side of the copper that is to be laminated to the prepreg, with a chemistry that enhances this bond. For many years this enhancement was provided by the so-called ”Black oxide pre-treatment”, more recently suppliers have developed a second-generation treatment referred to as ”Alternative Oxides”. An issue, which has confronted the industry for sometime, is to define a quantitative measurement that will be a reliable index of the likelihood that a particular PCB structure will suffer a delamination when exposed to a thermal event. The technique, which has been used for many years, is referred to as peel strength. Several test methods are available for this measurement in IPC_650. The purpose of this paper is to analytically compare the structural integrity of these treatments and quantify the relationship between peel strength vs. alternative thermal testing techniques. The alternative methods will include internal stress testing (1ST), thermal cycling (- 25℃ to +125 ℃/number of cycles) and thermal mechanical analysis (T-260) and this data will be compared to peel strength data on various industrial laminates.
印刷电路 氧化前处理 剥离强度 故障模式
Patrick Brooks Hugh Roberts Kuldip Johal Christian Sparing
Atotech Deutschland GmbH，Berlin Getmany
国内会议
上海
英文
254-262
2004-03-08（万方平台首次上网日期，不代表论文的发表时间）