Wafer-Level Burn-In and Test

摘要：

Wafer-Level Burn-In and Test (WLBT) is a method for burning-in semiconductor devices while still in wafer form. This has many advantages, one of which is the production of burned-in, Known Good Die (KGD.)Wafer-Level Burn-In and Test (WLBT) is a method for burning-in semiconductor devices while still in wafer form. This has many advantages, one of which is the production of burned-in, Known Good Die (KGD.)

关键词： 晶片级预烧 晶片测试 半导体设备 燃烧法

作者: Steve Steps

作者单位: Aehr Test Systems 400 Kato Terrace, Fremont, CA 94539 USA

会议类型: 国内会议

会议名称: 第二届中国国际集成电路研讨会

会议地点: 上海

会议语种:英文

页码: 323-327

在线出版日期: 2004-09-01（万方平台首次上网日期，不代表论文的发表时间）