Unique Air Floating Concept Head “Sylphide” for Nezt Generation CMP
(0) A novel polishing head was developed. It is verified that this head is suitable for low pressure polishing; linearity of the pressure down to 0.2psi and its repeatability during 15days were confirmed by measuring the actual wafer pressure. This performance is effective for low-k/Cu application. Also this head has a good controllability of edge profile. A flat profile was realized to lmm from wafer edge with IC1000, solo pad. The obtained WIWNU with E.E. of 1mm was 1.7％ 1-sigma and this indicates high planarity process can be realized even with a rotary tool. It also includes functions of low defectivity performance, profile controllability and quick parts exchange.
抛光头 边缘配置 平面配置 晶圆抛光
Akira Isobe
Accretech / Tokyo Seimitsu Co., Ltd.
国内会议
上海
英文
169-170
2004-09-01（万方平台首次上网日期，不代表论文的发表时间）