Opto Lithographic technologies for photomasks”production and components” forming for IC packing by Flip Chip method
The technologies of poto and laser lithography are widely used in IC production of different complexity,in semiconductor devices”production and also in production of hybrid circuits and precise circuit boards. The results of tests and also taking into account the demands of the production engineers of Bumping processallowed us to formulate the demands towards projectionoptics of new Bumping stepper EM-5534, which has noanalogues among photolithography equipment for thistechnology in the world.
激光光刻 集成电路 混合电路 光刻设备
U. Matsiushkov A. Ageichenko S. Avakaw
KBTEM-OMO Republican Unitary Scientific and Production Enterprise of Planar Concern
国内会议
上海
英文
161-168
2004-09-01（万方平台首次上网日期，不代表论文的发表时间）