Wafer Thinning Technology

摘要：

Positioned between front-end and back-endprocessing in semiconductor manufacturing, waferback-side grinding,the core of chip thinning, hasnot been considered much important. This articleintroduces thinning equipment that solves, as asingle unit, problems associated with peripheralprocesses and wafer transfer between the processes,along with some ”often-asked questions about backgrinders.” Wafer-thinning technology has become the focus ofattention lately; however, if thinning is the only purpose,proper choice of the etching process may solve the wholeprohlem. Etching process, including wet etching that relies on chemicals and dry etching that uses plasma, is anexcellent means to obtain a perfect crystal layer by removing a stress transition layer (damaged layer) formedin the grinding process.

关键词： 半导体制造 晶圆薄化 湿法刻蚀 干法刻蚀

作者: Kazuo Kobayashi

会议类型: 国内会议

会议名称: 第二届中国国际集成电路研讨会

会议地点: 上海

会议语种:英文

页码: 150-154

在线出版日期: 2004-09-01（万方平台首次上网日期，不代表论文的发表时间）