What Takes to Make High Performance IC Substrates
Making high-performance organic IC substrates necessitate more consideration than making PCB”s, even though the manufacturing processes share great similarities. Besides narrow line width/space and smaller via si2e, high-performance IC substrates often require specialty materials and circuit designs to achieve low impedance power distribution and low loss/high speed signal propagation. Manufacturing processes also need to be carefully selected or fine-tuned so as to produce the PCB like panels at reasonable yields. Upon completion of the board manufacturing and subsequent substrate singulation, IC substrates must be qualified for various assembly processes and must pass a series of stringent environmental tests. Therefore, the substrates are also required to exhibit robust thermal mechanical behavior and to perform well in harsh environments.
有机集成电路 印刷电路板 电路设计 装配工序 环境测试 制造工艺
Shichun Qu Robin E．Gorrell Daniel J．Foster Duy Le-Huu Guoping Mao Robert R．Kieschke
3M Eau Claire，2020 Prairie Lane，Eau Claire，WI 54702 3M CRL, 3M Center, B201-1C-30, Maplewood, MN 55144
国内会议
上海
英文
531-539
2004-03-08（万方平台首次上网日期，不代表论文的发表时间）