Morphologies and Properties of Cured Epoxy/Phenoxy/Cycrophenoxyphosphazen Blends for Halogen-free Incombustible FPC Adhesives
Halogen-free incombustibility has been required offlexible printed circuits(FPCs)applied for advanced digital electronic devices suchas cellphones，HDDs and LCDsbecause of tightening of environmental problems thesedays.Although epoxyadhesives have been used in producing FPCs usually，it should be a hard work toachieve halogen-free incombustibility withmaintaining the properties，such as Tg，tensile strength，elongation，peel strength，flexibility and isolation reliability. We havealready reported the effects of cycrophenoxyphosphazen(CPP) as a halogen-freeflame retardant on the properties of cured epoxy/NBR/CPP blends.It was foundthat NBR of a modifier showed some good features such as improving ductility andthen peel strength, on the other hand, NBR reduced isolation reliability in the tests ofion migration durability. Therefore, we have studied the properties of cured epoxy/phenoxy/CPP blends containing a phenoxy polymer instead of NBR and then sincewe found that those cured blends containing phenoxy as a modifier and CPP as ahalogen-free flame retardant showed high isolation reliability and high Tg withoutlosing incombustibility, we report the results.
Halogen-free incombustibility Morphologies Properties of Cured Epoxy Phenoxy Cycrophenoxyphosphazen Blends
Naoki YOKOYAMA Osamu MESAWA Katsuyuki AIDA Yukiko OGURA Koji NITTA Shinya TAKAHASHI Tomoyuki KASEMURA
Nippon Steel Chemical Co．,Ltd．and Tohto Kasei Co．,Ltd．,JAPAN, Tohto Kasei Co．,Ltd．,JAPAN Department of Applied Chemistry,Faculty of Engineering,Gifu University,JAPAN
国内会议
上海
英文
51-62
2008-05-29（万方平台首次上网日期，不代表论文的发表时间）