微孔填充及镀通孔:技术选择及解决方案
Miniaturization of electronics is setting demands for smaller and high density interconnects(HDI)for printed circuit boards and packaging. Functional reliabi-lity is highly dependent on the quality of direct metallization technology as well as the quality of filling microvias and plating through-holes.The demand for improved process performance has resulted in increased process complexity：several group of additives are used making process control almost impossible. Inaddition PPR technology has been applied as a solution，eventually in combination with additive stability through redox-protection of functional chemistry.A new technology approach，preserving simplicity and ensuring efficient process control，has been developed for simultaneous filling of microvias and excellent plating of through-holes.And the new concept has been tested and proven in industrial applications for panel as well as pattern plating. The new process is a drop-in process：It uses existing DC-power supplies and plating equipment. In addition，since process chemistry has been reduced to a minimum,bath life is increased and process quality is easily controlled.
微孔填充 镀通孔 技术选择
确信电子有限公司-乐思化学
确信电子有限公司-乐思化学
国内会议
深圳
中文
283-291
2007-10-25（万方平台首次上网日期，不代表论文的发表时间）