Interfacial reaction behavior and bonding mechanism between liquid Sn and ZrO2 ceramic exposed in ultrasonic waves
Ultrasound-assisted dipping of ZrO2 ceramics into molten Sn solder was performed to realize the low-temperature joining of ZrO2 ceramics in this study.Scanning electron microscopy with energy dispersive spectrometer,X-ray diffraction and X-ray photoelectron spectroscopy were employed to study the effects of ultrasonic vibration on the microstructure of Sn/ZrO2 interface,and to elucidate the joining mechanism between Sn coating layer and ZrO2 ceramic.Results showed that,after ultrasonically dipping in molten Sn for 1200 s,a pure Sn solder layer with a thickness of approximately 8~9 pm was coated on the ZrO2 surface.The Sn coating layer exhibited excellent metallurgic bonding with ZrO2 ceramic.A nano-sized ZrSnO4 ternary phase,which was beneficial to the smooth transition of the lattice from Sn solder to ZrO2 ceramic,was formed at the Sn/ZrO2 interface.The formation of ZrSnO4 interlayer was ascribed to the acoustic cavitation induced high-temperature reaction of Sn,O and ZrO2 at the molten Sn/ZrO2 ceramic interface.The tested average shear strength of ZrO2/Sn/ZrO2 joints was approximately 32 MPa,and the shearing failure mainly took place within the Sn solder layer.
ZrO2 ceramic pure Sn ultrasound-assisted dipping ZrSnO4
Dan Luo Yong Xiao Ling Wang
School of Materials Science and Engineering,Wuhan University of Technology,Wuhan 430070,China China National Electric Apparatus Research Institute Co,Ltd Guangzhou 510300,China
国内会议
苏州
英文
248-261
2018-11-01（万方平台首次上网日期，不代表论文的发表时间）