会议专题

2018中国电子设计创新大会

总文献量: 372篇会议类型: 国内会议会议地点: 北京主办单位: 《Microwave Journal》;《Signal Integrity Journal》;《微波杂志 Microwave Journal China》;Horizon House5香港雅时媒体集团的会展部会议日期: 2018-03-01

文章浏览

天線增益測量的技巧

Andnew KO Jason Cui

Increasing Measurement Accuracy of VNAs in the THz Range

Thilo Bednorz

Wideband mm-Wave 5G Antenna Solution for Mobile Device

Danny

Accurate GaN Modeling for RF Power Amplifier Design Enablement

Amit Dixit Marek Schmidt-Szalowski Petra Hammes Vittorio Cuoco Nelsy Monsauret

精确测量低中频变器的群时延特

程宁 Joel Dunsmore 陈新

Using 3D EM simulation tool to help Pre&Post layout simulation for improving the Signal Integrity in high speed SERDES lane

Kris Liu Brett Li

PDN Challenges in High Speed PCB Design

Trisecting S-parameter Block

Changhua Wan Feng Ling

如何应用宽带高精度幅相控制矩阵帮助进行5G的相关研究和测试

刘伟

Using 3D EM simulation tool to help Pre&Post layout simulation for improving the Signal Integrity in high speed SERDES lane

Kris Liu Brett Li

Radar Technology for IoT Applications

Henry Lau

广东生益科技股份有限公司

Using Eye Contours in Scopes to Analyze High-Speed Serial Digital Signals

Qiujie Lu

Simulation of BER,EVM and ACPR Performance under Proposed 5G Modulation Waveforms

Lars van der Klooster

Simulation of BER,EVM and ACPR Performance under Proposed 5G Modulation Waveforms

Gent Paparisto Joel Kirshman David Vye

PCIe Gen 4/Gen 5-How to measure the real jitter performance of an SSC clock

Martin Stumpf

能讯氮化镓技术优势及推荐应用

Component-Level Via Modeling and Optimization Technology

Rui wang

RF-Energy-Connectivity addressing the requirements of the future applications

Hannes Grubinger

Direct conversion with high-speed data converters and K-band application

Marc Stackler