会议专题

2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

总文献量: 268篇会议类型: 国际会议会议地点: 北京主办单位: 中国电子学会;中国半导体行业协会会议日期: 2009-08-10

文章浏览

Enhancement of TBGA Substrate in Packing Drop Test

Kelvin Pun C Q Cui

Modeling of Copper Wire Bonding Ball Transient Temperature Behavior

Techun Wang QingYi Zheng Rui Yu Zhongyun Li

EcoDesign Technical Committee of JIEP (Japan Institute of Electronics Packaging) and Its Activity

Hidetaka Hayashi

The Electrical, Mechanical Properties of Through-Silicon-Via Insulation Layer for 3D ICs

Sang-Woon Seo Jae-Hyun Park Min-Seok Seo Gu-Sung Kim

Growth and Recrystallization of Electroplated Copper Columns

Jun Liu Changqing Liu Paul P Conway Jun Zeng Changhai Wang

The Influence of Plastic-package on the Voltage Shift of Voltage Reference in Analog Circuit

Yanfeng Jiang Jiaxin Ju

On Reliability of Chips bonded on Flez Substrates Using Thermosonic Flip-Chip Bonding Processwith Nonconductive Paste

Cheng-Li Chuang Jong-Ning Aoh Wei-How Chen

Morphological and Microstructural Evolution of Sn-patch in SnAgCu Solder with Ni(V)/Cu under Bump Metallization

Kai-Jheng Wang Jenq-Gong Duh Su-Yueh Tsai