会议专题

the 3rd china japan symposium on mechatronics(第三届中日机械电子学学术讨论会)

总文献量: 76篇会议类型: 国际会议会议地点: 成都主办单位: 中国电子学会会议日期: 2002-09-09

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Thermal Design for High Density Avionics Package

Study of Upper Limb Powered Orthosis using Bilateral Servo Actuator Drove by Bi-articular Cylinder

Electromechanical Dynamics Analysis of Buckling Microstructure for Micromirror

Some of Research and Development on Micro Robotics and Systems in China

The Process Control Technique for Gold Wire Bonding of Multichip Modules

Realization of Environment-Contacting Task by Position-Controlled Manipulation with Free-Joint Structure

Goods Sending Authentification System and The development of Its Terminal Device

Research On High Precision Capacitance Displacement Sensor

A Technologic Method and Special Drill for Precision Holes of Antenna part

On Control Methodology of the Flexible Structure with High Precision Dynamic Positioning Requirement

The Plan and the Problems on Developing Human Interface Communication System

The kinematics simulation of parallel NC machine tool in manufacturing process

Position Control of Mobile Robots using Global Vision with Fast Color Image Segmentation

The Research in Nonlinear DesignTheory for the Micro Sensor Array of the Acceleration

Performance Testing of High Speed Analog-to-Digital Converter System

Fast and Robust Extraction of Color Markers for a Mobile Robot Vision

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