Whey protein based environmentally safe adhesives for plywood manufacture
Whey is a by-product of cheese making. Whey and whey proteins are still under utilized even through they have been widely used as food ingredients. In this study, plywood adhesives were developed using whey protein isolate as a major ingredient. The effects of four modifiers (glyoxal, glutaraldehyde, glyoxal/glutaraldehyde mixture and polyisocyanate) on the bond strength, bond durability and free formaldehyde release of plywood panels were investigated. The results indicated that the whey protein-based plywood adhesives are environmental safe products with much lower free formaldehyde releases than the required level of commercial standards. The modifications improved dry bond strength of the plywood panels to some extent, and the glutaraldehyde proved to be the best; while the introductions of these modifiers had negative impact on the bond durability of the plywood panels. The denatured whey protein alone as an adhesive showed the best bond durability with a 28-h boiling-dry-boiling strength higher than the required value of commercial standard. The whey protein adhesives modified by glyoxal, glutaraldehyde and polyisocyanate could be used to produce moisture-resistant plywood panels for indoor uses; however, only the plywood panels bonded by the denatured whey protein itself were water-resistant. FTIR analysis indicated the cured whey protein based adhesives had similar IR absorption due to the very low level of modifier content. The SEM analyses of cured adhesives confirmed that adhesives modified by glyoxal, glutaraldehyde, glutaraldehyde/glyoxal mixture, and polyisocyanate resulted in many interspatial defects for phase separations and, therefore, led to the poor bond durability
adhesive whey protein plywood modification bond strength bond durability
Wang Wenbo Zhao Zongyan Gao Zhenhua Michael VAYDA Guo Mingruo
University of Vermont, Burlington, VT 05405, USA Northeast Forestry University, Harbin, China 150040
国际会议
2010 Beijing International Bonding Technology Symposium(2010北京国际粘接技术研讨会)
北京
英文
81-89
2010-10-31（万方平台首次上网日期，不代表论文的发表时间）