Study on the Microstructure and the Shear Strength of Sn-0.7Cu-zZn

摘要：

The effects of 0.3 wt.％ Zn and 1 wt.％ Zn addition on the melting point, the microstructure and the shear strength of Sn-0.7Cu were investigated. With small amount of Zn addition, the melting point decreased a little, and refined microstructure was observed especially for Sn-0.7Cu-1Zn and the fraction of eutectic region increased. Cu-Zn intermetallic compounds (IMCs) were detected in Sn-0.7Cu-1Zn at the phase boundary between β-Sn and eutectic region. Shear strength of solders increased with strain rate lineally in log-log plot. The strength of Sn-0.7Cu-1Zn was much higher than that of Sn-0.7Cu, which was similar to that of Sn-0.7Cu-0.3Zn. Ductile fracture was observed in all solders.

作者: Yan-jun Gao Zhong-bing Luo Jie Zhao Lai Wang

作者单位: School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China.

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 890-893

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）