Promotion of Activation Treatment Containing Rare Earth Element to Silver Plating Copper Powder

摘要：

In order to improve activated performance and the rate of silver on copper powder surface, a minute amount of rare earth element Ce was added into the activation solution before electroless plating. Polarization curves of activation solution, micromorphology and the rate of silver on copper powder surface were studied through electrochemical workstation, scanning electron microscopy, etc. The results showed that rare earth element added to the palladium activation solution with appropriate proportion, enabled the polarizability decreasing, the static potential and plating potential increasing. Therefore, the reaction of activation solution became easier. Little rare earth element can increase the deposition speed and rate of silver on copper powder surface. With a further increase of rare earth element content, the surface microstructure of silver planting copper powder became more refined and denser gradually.

关键词： rare earth silver planting copper powder activation

作者: XUAN Tian-Peng ZHANG Li-li

作者单位: Material Science and Engineering Institute,Hefei University of Technology,Hefei 230009,China

会议类型: 国际会议

会议名称: The Fourth Asian Conference on Heat Treatment and Surface Engineering(第四届亚洲热处理及表面工程大会)

会议地点: 北京

会议语种:英文

页码: 630-634

在线出版日期: 2009-10-27（万方平台首次上网日期，不代表论文的发表时间）