PrimePACK TM – The New High Power IGBT Module Concept

摘要：

In this paper, a new series of high-power IGBT modules named PrimePACK? Is described. Compared to the existing IHM series of high-power IGBT modules, PrimePACK? Offers lower stray inductance, lower Rth value and 150 ℃ operational Tvj limit with the innovative housing design and improved module technology. Moreover, using the newly developed 4 th generation of IGBT and EmCon diode–IGBT4 and EmCon4, PrimePACK? Shows significantly reduced voltage overshoot and oscillation at the switching transients. This paper first presents the construction of PrimePACK? And shows a brief comparison with the IHM module. Followed is a brief introduction to the 1200V IGBT4 and EmCon4 and their advantages. Some further insight into this new module is then presented and preliminary product range is given. Application concepts are shown in the end of this paper.

作者: Zhihong Liang Zhenbo Zhao

作者单位: Infineon Technologies China Co.Ltd., No.7-8, Lane 647, Songtao Rd., Shanghai, P.R.China 201203

会议类型: 国际会议

会议名称: PCIM China 2007(International Conference Power Electronics)(2007年中国电力电子技术国际会议)

会议地点: 上海

会议语种:英文

在线出版日期: 2007-03-21（万方平台首次上网日期，不代表论文的发表时间）