Reliability of High Density Wire Bonding in X band T/R Module
Wire bonding technology has been widely used in X band T/R module,and its reliability directly determines the RF characteristics and lifetime of T/R module.The reliability of wire bonding is greatly influenced by the surface quality of bonding area.In this paper,comparative study of different T/R module cleaning process such as anhydrous ethanol,plasma cleaning on the reliability of the wire bonding was carried out.Meanwhile,laser cleaning was also studied as a new process.It was found that the tensile strength of wire bonding after laser cleaning was improved by about 90%compared with that using traditional cleaning process.
Wire bonding Strength Laser cleaning
Dongliang Wang Feifan Yan Yuting Zeng Yulan Li
Jiangsu Jinling Machinery Factory Nanjing,China
国际会议
上海
英文
372-375
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）