Investigation of microstructure and growth behavior of CoSn3 full intermetallic joints in electronic packaging
In traditional transient liquid phase(TLP)bonding process,pure Sn was electroplated on the Cu pillar.Then the Cu pillars were bonded to form the Cu/IMCs/Cu joints under external temperature and pressure.However,the temperature and pressure are often too high for some sensitive components.It is significant to develop an alternative packaging structure which could be rapidly fabricated under low level temperature and pressure.The objective of this present work is to investigate the feasibility of using Co substrate for such a purpose.In this study,Sn foil with the thickness of 80 μm and pure Co substrates were used to fabricate the Co/Sn/Co sandwich structure.The joints were aged at 250 ℃ to investigate the growth of interfacial IMCs.The Co/IMCs/Co full IMCs joints can be obtain under low aging temperature.The CoSn3 interfacial IMCs were formed at Sn/Co interface.The rapid growth of CoSn3 IMCs made Co/IMCs/Co a promising structure to replace traditional Cu under bump metal.
TLP Bonding Co substrate CoSn3 IMCs Microstructure Growth behavior
Shuang Tian Xuemei Zhang Jian Zhou Feng Xue
Jiangsu Key Laboratory for Advanced Metallic Materials Southeast University Nanjing,China
国际会议
上海
英文
1051-1054
2018-08-08（万方平台首次上网日期，不代表论文的发表时间）