Ultrasonic-assisted soldering of SAC0307 solder with Nano-particles active-flux

摘要：

　　Nano-particles active-flux and ultrasonic were utilized to achieve Cu/Cu joint with low temperature and fast soldering(180s).The shear strength of SAC0307 solder joint can reach 22.15MPa.The thickness of IMCs was not more than 2.5μmin all joints.The micromorphology had no obvious change with the change of ultrasound and NPs.The shear strength of SAC0307 solder joint was increased 47.18%and 34.35%with Nano-Ni particles active-flux and Ni-CNT particles active-flux for ultrasonic time at 3srespectively.The shear strength of all joints was increased first and then decreased with the increase of ultrasonic time.Ultrasound and NPs can improve the shear strength.Ultrasound hadgreater effects on active-flux joint and Nano-Ni particles active-flux joint,but Ni-CNT particles active-flux joint was the opposite.

关键词： SAC0307 solder Ultrasonic-assisted shear strength CNT active-flux with Ni coating Nano-Ni particles active-flux

作者: Da-quan Xia Xin Liu Gui-sheng Gan Dong-hua Yang Yu-feng Zhou Yi-ping Wu

作者单位: College of Materials Science and Engineering Chongqing University of technology Chongqing,China Institute of Weapons Technology Chongqing Electromechanical Vocational Institute Chongqing,China

会议类型: 国际会议

会议名称: 第十九届国际电子封装技术会议(ICEPT 2018)

会议地点: 上海

会议语种:英文

页码: 1696-1701

在线出版日期: 2018-08-08（万方平台首次上网日期，不代表论文的发表时间）