Near-threshold Fatigue Crack Behavior of Thin Copper Sheet and its Application for Structural Health Monitoring

摘要：

　　Smart stress-memory patch is a novel sensing method in structural health monitoring for evaluating fatigue damage.The patch can estimate the number of cycles and stress amplitude using fatigue crack growth properties in Paris region of thin metal sheets.In this study,near-threshold fatigue crack growth behavior in thin pure copper sheet was investigated under strain-controlled testing to improve the measuring range and accuracy.

关键词： Fatigue crack growth Finite element method Copper Structural health monitoring Smart stress-memory patch

作者: Takayuki Shiraiwa Manabu Enoki

作者单位: Department of Materials Engineering,The University of Tokyo,Tokyo 113-8656,Japan

会议类型: 国际会议

会议名称: 第13届国际断裂大会(ICF2013)

会议地点: 北京

会议语种:英文

页码: 1-10

在线出版日期: 2013-06-16（万方平台首次上网日期，不代表论文的发表时间）