Behavior of interface crack in layered structure under actions of both stress wave and residual stress
The propagation characteristic of stress wave impinging at the interface between initially stressed film and substrate is analyzed to reveal the effect of residual stress on the fracture behavior of such layered structure. In particular, the response of the layered structure to both stress wave and residual stress is investigated based on an axis-symmetric model including a centric coin-shape interface crack. The dispersion of the stress wave and the dynamic stress concentration around the interface crack tip are discussed with the crack surface contacting behavior being involved in the model. It is revealed that the strain energy release rate at the crack tip would be dependent on the interface crack length. The results also indicate that the residual stress would influence greatly the in-plane stress of the film and therefore determine the fracture pattern of the film.
Layered structure Residual stress Stress wave Interface crack
ChenWu Wu XinXin Cheng YuChen Yuan
Institute of Mechanics,Chinese Academy of Sciences,Beijing 100190,China;Department of Engineering Te Institute of Mechanics,Chinese Academy of Sciences,Beijing 100190,China;School of Physics,University
国际会议
北京
英文
1-7
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）