Mixed-mode crack initiation at the edge of Cu/Si interface in nanoscale components
The crack initiation behavior under the mixed-mode at the edge of a Cu/Si interface in nanoscale components has been investigated by a novel torsion method using a double nano-cantilever specimen consisting of a 20-nm-thick Cu layer and a Si substrate.By using this nano-cantilever torsion method,the shear stress is applied to the Cu/Si interface with the nanoscale stress concentration through the transverse arm.The mode mixity,which is the ratio of the shear stress to the normal stress,can be precisely controlled by changing the loading position.During the experiment,the crack is successfully initiated at the Cu/Si interface edge for various mode mixities by the developed method.The detailed stress fields along the Cu/Si interface at the critical loads for crack initiation are analyzed by the finite element method,and the stress concentration region near the interface edge in all specimens is within the scale of 100 nm.The critical normal stress and maximum shear stress at crack initiation have a circular relation.
Nanoscale Mixed-mode Crack initiation Interface Torsion test
Yabin Yan Kohei Kishimoto Takashi Sumigawa Takayuki Kitamura
Institute of Structural Mechanics,China Academy of Engineering Physics,Mianyang 621900,China Department of Mechanical Engineering and Science,Kyoto University,Kyoto 606-8501,Japan
国际会议
北京
英文
1-10
2013-06-16（万方平台首次上网日期，不代表论文的发表时间）