Ceramic Column Grid Array:A High-reliability Approach for Area Array Packaging

摘要：

　　Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package.The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect,and to achieve a significant increase in reliability.This paper introduced a technology of CCGA package with LGA717 substrate,it specifically discussed the coplanarity,the void rate and the solder joint strength.By design of the daisy-chain substrate,the board-level reliability of the CBGA and CCGA packages were investigated.The CCGA components had longer life than that of the CBGA components.

作者: Yingzhuo Huang Xueming Jiang Pengrong Lin Yusheng Cao Binhao Lian Quanbin Yao

作者单位: Beijing Microelectronics Technology Institute Beijing,100076,China

会议类型: 国际会议

会议名称: 2012 International Conference on Electronic Packaging Technology & Hiigh Pachaging(2012电子封装和高密度封装国际会议(ICEPT-HDP2012))

会议地点: 桂林

会议语种:英文

页码: 930-933

在线出版日期: 2012-08-13（万方平台首次上网日期，不代表论文的发表时间）