High-Efficiency Millimeter-Wave Substrate Integrated Waveguide Silicon On-Chip Antennas Using Through Silicon Via

摘要：

In this paper, the through silicon via (TSV) technology is employed to design millimeter-wave substrate integrated waveguide (SIW) based on-chip antennas. The TSV based SIW is first characterized with different silicon resistivity, substrate thickness and via pitch size. Then a high-efficiency TSV based SIW antenna is demonstrated.

作者: Yong-Xin Guo Hui Chu

作者单位: National University of Singapore, Department of Electrical and Computer Engineering4 Engineering Dri National University of Singapore, Department of Electrical and Computer Engineering 4 Engineering Dr

会议类型: 国际会议

会议名称: 2010国际超宽带会议(ICUWB 2010)

会议地点: 南京

会议语种:英文

页码: 1-4

在线出版日期: 2010-09-20（万方平台首次上网日期，不代表论文的发表时间）