Failure Modes and Failure Analysis of White LEDs

摘要：

Reliability is one of primarily considered problems in white LED application. In this presentation, main failure modes in white LEDs such as ohmic contact degradation, electrode bonding defect, thermal mismatch and degradation of the encapsulation material, as well as ESD damage were analyzed, also combination with many failure analysis practices. Finally, several reliability assurance measures were discussed, which is helpful to improve reliability of LEDs in the solid state lighting applications.

关键词： White LED failure modes degradation Failure analysis.

作者: Fugen Wu Wei Zhao Shaohua Yang Chunhua Zhang

作者单位: Experiment Center,Guangdong University of Technology,Guangzhou 510006,China National Key Laboratory for Reliability Physics of Electronic Product,the No.5 Institute of MII,Guan

会议类型: 国际会议

会议名称: 2009 9th International Conference on Electronic Measurement & Instruments(第九届电子测量与仪器国际会议 ICEMI2009)

会议地点: 北京

会议语种:英文

页码: 4206-4209

在线出版日期: 2009-08-16（万方平台首次上网日期，不代表论文的发表时间）