An In-Depth Numerical Investigation into Packaging Design of Multi-Finger GaInP/GaAs Collector-Up HBTs

摘要：

A novel finite-element modeling approach is developed to design thermal-via packaging configurations of collectorup heterojunction bipolar transistors (C-up HBTs) in highpower amplifiers (HPAs). The thermal interaction between HBT fingers has been examined based on the temperature distribution phenomena in multifinger C-up HBTs. The results reveal that the overall compactness of thermal-via configuration can be further improved more than 33％.

作者: H. C. Tseng J. Y. Chen

作者单位: Department of Electronic Engineering, Kun Shan University949, Da Wan Rd., Tainan, 71003, Taiwan Department of Electronic Engineering, Kun Shan University 949, Da Wan Rd., Tainan, 71003, Taiwan

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 280-282

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）