Inspection of Miniaturised Interconnections in IC Packages with Nanofocus X-Ray Tubes and NanoCT

摘要：

Nanofocus tube technology and high resolution CT are the future inspection tools for IC packages. The elementary principles and techniques of latest 2D and 3D nanofocus techniques are briefly outlined and typical results of highest resolution failure analysis including bond wire defects, copper bond wire inspection, Flip Chip solder interconnection and microvia inspection are presented.

作者: Zhenhui He Quan Wen Xiaojie Huang

作者单位: GE Sensing & Inspection GmbHNiels-Bohr-Str.7, 31515 Wunstorf, Germany GE Sensing & Inspection GmbH Niels-Bohr-Str.7, 31515 Wunstorf, Germany

会议类型: 国际会议

会议名称: 2009 International Conference on Electronic Packaging Technology & High Density Packaging(2009 电子封装技术与高密度集成技术国际会议)

会议地点: 北京

会议语种:英文

页码: 996-1001

在线出版日期: 2009-08-10（万方平台首次上网日期，不代表论文的发表时间）