NUMERICAL EVALUATION ON THE COOLING CAPABILITY OF MEMS BASED LIQUID METAL COOLING DEVICE USED IN HARSH ENVIRONMENT

摘要：

The thermal management of the increasing fast chips has been a major concern in packaging of micro/nano systems 1. These chips are squeezing into tighter and tighter spaces with no enough places for heat to dissipate. It is expected that heat flux levels in excess of 100 W/cm 2 for commercial electronics and over 1000 W/cm 2 for selected military high power electronics will soon become a realistic challenge to overcome. Meanwhile, high-capacity cooling options remain limited for many small-scale applications such as micro-systems, sensors and actuators, and micro/nano electronic components.

作者: Zhong-Shan Deng Jing Liu Yi-Xin Zhou

作者单位: Cryogenics Lab, P. O. Box 2711, Technical Institute of Physics and Chemistry,Chinese Academy of Sciences, Beijing 100080, China

会议类型: 国际会议

会议名称: 2007年微纳系统集成及其商业化应用国际学术会议(2007 International Conference & Exhibition on Integration and Commercialization of Micro and Nano-Systems)

会议地点: 海南三亚

会议语种:英文

在线出版日期: 2007-01-10（万方平台首次上网日期，不代表论文的发表时间）